| 摘要 |
The present invention relates to a semiconductor device, a semiconductor package, and a method to manufacture the semiconductor device and the semiconductor package. According to an embodiment of the present invention, As an embodiment of the present invention, the semiconductor device comprising: a conductive pad formed at one surface and a conductive bump connected to the conductive pad, a plurality of semiconductor shelves accumulated to have a non-overlapped area at a part in which the conductive pad is formed; a first in-capsule individually formed at the non-overlapped area; and a plurality of shoulder balls located on the same layer as the conductive bump by being connected to the conductive bump. According to the present invention, the present invention is to provide a semiconductor device having a more slim thickness, a semiconductor package, and a method to manufacture the semiconductor and the semiconductor package. |
