发明名称 |
CERAMIC ELECTRONIC COMPONENT |
摘要 |
<p>The present disclosure relates to a ceramic electronic component, which includes a chip body; an external electrode forming part which are formed at both ends of at least one length direction of the upper surface and the lower surface of the chip body; an external electrode which is formed in the external electrode forming part; and a protection layer which is formed between the external electrode forming part and is thicker than the external electrode.</p> |
申请公布号 |
KR20150080797(A) |
申请公布日期 |
2015.07.10 |
申请号 |
KR20140000287 |
申请日期 |
2014.01.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, SUNG JIN;SHIN, HYEOG SOO |
分类号 |
H01F17/00;H01F27/28 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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