发明名称 CERAMIC ELECTRONIC COMPONENT
摘要 <p>The present disclosure relates to a ceramic electronic component, which includes a chip body; an external electrode forming part which are formed at both ends of at least one length direction of the upper surface and the lower surface of the chip body; an external electrode which is formed in the external electrode forming part; and a protection layer which is formed between the external electrode forming part and is thicker than the external electrode.</p>
申请公布号 KR20150080797(A) 申请公布日期 2015.07.10
申请号 KR20140000287 申请日期 2014.01.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, SUNG JIN;SHIN, HYEOG SOO
分类号 H01F17/00;H01F27/28 主分类号 H01F17/00
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