发明名称 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which prevents magnetization around a coil by blocking magnetic flux flowing around the coil so that properties of changes in inductance (L) upon current application is improved, while achieving maximum inductance by obtaining enough filling magnetic volume, and to a manufacturing method thereof.</p>
申请公布号 KR20150080717(A) 申请公布日期 2015.07.10
申请号 KR20140000139 申请日期 2014.01.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, MOON SOO;LEE, DONG HWAN;HAN, JIN OK;KIM, TAE YOUNG;CHA, HYE YEON
分类号 H01F17/00;H01F27/28 主分类号 H01F17/00
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