| 摘要 |
FIELD: chemistry.SUBSTANCE: invention can be used in electronic industry. A method of producing silicon dioxide particles, wherein water-absorption capacity is less than 1.0% when measured 500 hours after holding at 50°C and humidity of 90% and at 85°C and humidity of 85% D90/D10 is 3 or less, absolute density is 2.1 g/cmor higher, and the mean particle diameter is 10 mcm or less. The method includes a step (1) of producing silicon dioxide particles by hydrolysis of tetraethoxysilane and/or a derivative thereof and a step (2) of annealing the silicon dioxide particles obtained at step (1) at 900-1050°C. A sealing polymer composition contains said silicon dioxide particles.EFFECT: invention enables to obtain silicon dioxide particles having a narrow size distribution and low water-absorption capacity, which are suitable for use as filler for a sealing polymer composition.7 cl, 3 tbl, 27 ex, 2 dwg |
