| 摘要 |
<p>The present invention relates to a plate processing device for processing one surface of a plate having a band shape and the plate processing device comprises: a plurality of cutting members for cutting one surface of a plate by rotating the plate; a base unit on which each of the plurality of cutting members are rotationally provided; a first driving unit which rotates the base unit and moves at least one cutting member from among the plurality of cutting members to a cutting position; a second driving unit for rotating the cutting member located at the cutting position; and a third driving unit which moves the base unit in a processing direction of the plate so as to move the cutting member located at the cutting position in the processing direction of the plate.</p> |
