发明名称 COOLING SYSTEMS AND METHODS USING TWO CIRCUITS WITH WATER FLOW IN SERIES AND COUNTER FLOW ARRANGEMENT
摘要 The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
申请公布号 US2015192345(A1) 申请公布日期 2015.07.09
申请号 US201414534957 申请日期 2014.11.06
申请人 Inertech IP LLC 发明人 McDonnell Gerald;Zhang Ming;Costakis John;Keisling Earl
分类号 F25D17/02;F25B1/00 主分类号 F25D17/02
代理机构 代理人
主权项 1. A cooling system comprising: a first evaporator coil in thermal communication with an air intake flow to a heat load; a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit; a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow to the heat load; a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit; a water circuit in thermal communication with the first fluid circuit and second fluid circuit; and a chiller circuit in thermal communication with the water circuit.
地址 Danbury CT US