RHODIUM PLATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a rhodium plating film usable as an electric contact having an electric resistance value lower than that of conventional ones.SOLUTION: A rhodium plating film of the present invention is formed on a base material, and has a surface layer part including numerous projections formed thereon, the projections being formed by setting a current density within a range of 10-500 A/dmto precipitate rhodium. In the rhodium plating film of the present invention, the surface layer is preferably formed on a base layer part after the base layer part with a flat surface has been formed, the base layer part being formed by setting a current density within a range of 1-10 A/dmto precipitate rhodium. On the base material, a base plating part is formed by applying base plating using metal having high adhesion to both of a surface of the base material and the rhodium plating film. The rhodium plating film is preferably formed on the base plating part.