SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer manufacturing method which can reduce generation of cracks in semiconductor wafer.SOLUTION: A semiconductor wafer manufacturing method comprises: a process of attaching a semiconductor crystal on a support plate; a process of processing the semiconductor crystal; and a process of heating the support plate, in which a thermal expansion coefficient difference between the support plate and the semiconductor crystal is equal to or less than 40%.