High power portable device and docking station

摘要

A system includes a high performance but very compact computer processing module and an associated docking station. The module includes a processor that is contained within an outer housing. The outer housing defines a heat transmission surface that is thermally coupled to the processor and other heat generating components in the module. The docking station includes a receiving portion for receiving a portion of the outer housing of the module. The docking station also includes a thermally conductive substrate defining a heat receiving surface which aligns with the heat transmission surface when the module is installed to the receiving portion. An array of conductive fibers thermally couples the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface with high reliability with repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure coupling or unreliable repetitive thermal coupling and decoupling. The high performance computing processor is detached from heatsink and fan, and hence is compact enough to enable a person to carry a high performance computer in their pocket.

主权项

1. A high power portable device and docking station system (“system”) comprising:
A high power portable device including:
a heat generating apparatus generating at least 8 watts of heat during full load operation;a housing with at least a portion of area having a thermally conductive surface for thermal coupling to external cooling apparatus;a thermally conductive heat transfer element thermally coupled to the thermally conductive surface of the housing and the heat generating apparatus for efficient transmission of heat from the heat generating apparatus to the conductive surface of housing;anda thermal interface element disposed on the thermally conductive surface of the housing including a means of thermal connectivity capable of providing thermal resistance lower than 10 degree Celsius per square centimeter per watt of heat transmitted to an external array of thermally conductive fibers in contact with it under low pressure and without any need of use of gels, fluids, and grease; and A docking station having a means to dissipate heat, and thereby capable of cooling the high power portable device including:
a thermally conductive substrate thermally coupled to the means to dissipate heat;anda first array of thermally conductive compliant fibers for accepting the heat through contact with the means of thermal connectivity at one end, permanently disposed on and thermally coupled to the thermally conductive substrate at the other end, thereby capable of cooling the high power portable device.