发明名称 Titanium nickel niobium alloy barrier for low-emissivity coatings
摘要 A method for making low emissivity panels, including control the composition of a barrier layer formed on a thin conductive silver layer. The barrier structure can include a ternary alloy of nickel, titanium, and niobium, which showed improvements in overall performance than those from binary barrier results. The percentage of nickel can be between 5 and 15 wt %. The percentage of titanium can be between 30 and 50 wt %. The percentage of niobium can be between 40 and 60 wt %.
申请公布号 US2015191815(A1) 申请公布日期 2015.07.09
申请号 US201514661958 申请日期 2015.03.18
申请人 Intermolecular Inc. 发明人 Ding Guowen;Boyce Brent;Cheng Jeremy;Imran Muhammad;Lao Jingyu;Le Minh Huu;Schweigert Daniel;Sun Zhi-Wen Wen;Wang Yu;Xu Yongli;Zhang Guizhen
分类号 C23C14/08 主分类号 C23C14/08
代理机构 代理人
主权项 1. A method of forming a low emissivity panel, the method comprising: providing a transparent substrate; forming a first layer above the transparent substrate, wherein the first layer comprising silver; and forming a second layer above the first layer, wherein the second layer comprises an alloy of nickel, titanium, and niobium, wherein the percentage of nickel in the alloy is about 10 wt %, the percentage of titanium in the alloy is about 40 wt %, and the percentage of niobium in the alloy is about 50 wt %.
地址 San Jose CA US