| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which enables improvement of cooling performance while maintaining a device size and an on-resistance.SOLUTION: A semiconductor device (100) includes a semiconductor body (20) in which a gate electrode (17) having a trench structure is buried. The semiconductor device (100) is provided with a heat absorption part (30) connected with an end part of the gate electrode (17) which is exposed on a surface of the semiconductor body (20), the heat absorption part (30) which absorbs heat generated in the semiconductor body (20) through the gate electrode (17). |
