发明名称 METHOD OF BONDING METAL PLATES
摘要 PROBLEM TO BE SOLVED: To provide a method of bonding metal plates capable of easily manufacturing a metal mask for printing a large sized solder screen.SOLUTION: The method of bonding metal plates for bonding metal plates includes: a step of alternately forming salient parts and recess parts of a same shape at an end part of a first metal plate and a second metal plate; and a step of fitting the salient parts of the first metal plate to the recess parts of the second metal plate and fitting the salient parts of the second metal plate to the recess parts of the first metal plate. The first metal plate and the second metal plate are metal masks for printing a large sized solder screen.
申请公布号 JP2015128123(A) 申请公布日期 2015.07.09
申请号 JP20130273716 申请日期 2013.12.30
申请人 MATSUI ELECTRIC INDUSTRIAL CO LTD;ITO PRINT KK 发明人 FUJITA TAKASHI;ITO NORIHIDE
分类号 H05K3/34 主分类号 H05K3/34
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