| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition for reflecting light, having a rigidity to the extent that the composition can be pulverized at around room temperature and reducing fully the attachment thereof to a processing apparatus or a molding apparatus; a substrate for mounting an optical semiconductor using the thermosetting resin composition; a method for producing the substrate for mounting the optical semiconductor; and an optical semiconductor device.SOLUTION: A production method of a powder thermosetting resin composition comprises the steps of: mixing raw materials of a thermosetting resin composition containing an epoxy resin, a curing agent containing organic acid anhydride having a melting point of 100°C or more, and a white pigment; cooling the thermosetting resin composition obtained by mixing; and dry-pulverizing the cooled thermosetting resin composition. |
