发明名称 WIRING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring structure that has excellent connection reliability while achieving high-speed signal transmission supporting, for example, a frequency domain of several tens GHz, and has excellent signal transmission characteristics without a stub structure and land.SOLUTION: A wiring structure has a first insulating layer 12, a second insulating layer 13 formed on the first insulating layer 12, a wiring 14 formed on the first insulating layer 12, and a connection part 16 connected to the wiring 14. The material of the second insulating layer 13 has a larger ablation speed by the irradiation of a laser beam than the material of the first insulating layer 12, and a larger ablation speed by the irradiation of a laser beam than the material of the wiring 14.</p>
申请公布号 JP2015128106(A) 申请公布日期 2015.07.09
申请号 JP20130273117 申请日期 2013.12.27
申请人 FUJITSU LTD 发明人 FUKUMORI HIROMASA;MIZUTANI DAISUKE
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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