| 摘要 |
PROBLEM TO BE SOLVED: To provide tungsten film polishing slurry, and more specifically, tungsten film polishing slurry capable of decreasing dishing and erosion generated during a polishing process, and a substrate polishing method using the same.SOLUTION: Polishing slurry for a tungsten film comprises: an abrasive for polishing having positive zeta potential; and a potential modulator for controlling the zeta potential of the abrasive, the potential modulator comprising a compound of three or more components including iron. |
