发明名称 CAMERA MODULE
摘要 A camera module according to an exemplary embodiment of the present disclosure is proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing member arranged at an upper surface of the PCB, a bobbin movably positioned at an inner side of the housing member, an upper elastic member connected to an upper surface of the housing member and to an upper surface of the bobbin, and a space forming part formed at one side of the housing member to provide a moving space to the upper elastic member when the bobbin makes a relatively vertical movement to the housing member.
申请公布号 US2015195438(A1) 申请公布日期 2015.07.09
申请号 US201514588479 申请日期 2015.01.02
申请人 LG INNOTEK CO., LTD. 发明人 PARK Sang Ok;LEE Seong Min;LEE Jun Taek
分类号 H04N5/225;H04N5/232 主分类号 H04N5/225
代理机构 代理人
主权项 1. A camera module, the camera module comprising: a PCB (Printed Circuit Board) mounted with an image sensor; a housing member arranged at an upper surface of the PCB; a bobbin movably positioned at an inner side of the housing member; an upper elastic member connected to an upper surface of the housing member and to an upper surface of the bobbin; and a space forming part formed at one side of the housing member to provide a moving space to the upper elastic member when the bobbin makes a relatively vertical movement to the housing member.
地址 Seoul KR