| 发明名称 |
TRANSDUCER SUPPORT, ULTRASOUND PROBE, AND ULTRASOUND IMAGING APPARATUS |
| 摘要 |
The present disclosure provides a transducer support, ultrasound probe, and ultrasound imaging apparatus. The ultrasound transducer support includes a first layer having first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, the first and second areas being arranged alternately; and a second layer having third areas located below the first areas in which sound absorbent materials are arranged and fourth areas located below the second areas in which heat transfer materials are arranged. |
| 申请公布号 |
US2015194143(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201414511511 |
申请日期 |
2014.10.10 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WON Chang Yeon;Ko Hyun Phill;Kim Sung Ki;Na Jeong Mln;Jo Jae Moon |
| 分类号 |
G10K11/00;G01S7/52;G01S15/02;G10K11/18 |
主分类号 |
G10K11/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A transducer support comprising:
a first layer comprising first areas in which heat transfer materials are arranged and second areas in which sound absorbent materials are arranged, wherein the first and second areas are arranged alternately; and a second layer comprising third areas located directly below the first areas in which sound absorbent materials are arranged and fourth areas located directly below the second areas in which heat transfer materials are arranged. |
| 地址 |
Suwon-si KR |
