| 发明名称 |
3D BARRIER SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE |
| 摘要 |
An embodiment of the present invention discloses a 3D barrier substrate o and a method for manufacturing the same, and a display device in order to improve the utilization of facilities, increase the production efficiency, and decrease the cost of production. The method of manufacturing 3D barrier substrate comprises: forming a transparent electrode thin film on a substrate, and forming a passivation layer on the transparent electrode thin film; forming an transparent electrode and a passivation layer via hole by a patterning process, wherein the via hole is used for coupling the transparent electrode to the signal line; and forming a signal line, wherein the signal line is coupled to the transparent electrode through the via hole. |
| 申请公布号 |
US2015194660(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201314353792 |
申请日期 |
2013.12.17 |
| 申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;BEIJING BOE DISPLAY TECHNOLOGY, LTD. |
发明人 |
Guo Huibin;Wang Shoukun;Liu Xiaowei;Zhu Xiaming;Guo Zongjie |
| 分类号 |
H01M4/02;H05K1/11;H05K1/02;H01M4/04;H05K1/09 |
主分类号 |
H01M4/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a three-dimensional (3D) barrier substrate, comprising:
forming a transparent electrode thin film on a substrate, and forming a passivation layer on the transparent electrode thin film; forming a transparent electrode and a passivation layer via hole by a patterning process, wherein the via hole is used for coupling the transparent electrode to a signal line; and forming the signal line, wherein the signal line is coupled to the transparent electrode through the via hole. |
| 地址 |
Beijing CN |
