| 发明名称 |
LIQUID DEPOSITION COMPOSITION AND PROCESS FOR FORMING METAL THEREFROM |
| 摘要 |
A process for depositing a metal includes disposing a liquid deposition composition on a substrate, the liquid deposition composition including a metal cation; a reducing anion; and;a solvent; evaporating the solvent; increasing a concentration of the reducing anion increases in the liquid deposition composition due to evaporating the solvent; performing an oxidation-reduction reaction between the metal cation and the reducing anion in response to increasing the concentration of the reducing anion when the reducing anion is present at a critical concentration; and forming a metal from the metal cation to deposit the metal on the substrate. |
| 申请公布号 |
US2015191825(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201514645366 |
申请日期 |
2015.03.11 |
| 申请人 |
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY |
发明人 |
HILDRETH OWEN J. |
| 分类号 |
C23C18/31;C23C18/16;C23C18/52;H01L21/3205;C23C18/48 |
主分类号 |
C23C18/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for depositing a metal, the process comprising:
disposing a liquid deposition composition on a substrate, the liquid deposition composition comprising:
a metal cation;a reducing anion; anda solvent; evaporating the solvent; increasing a concentration of the reducing anion in the liquid deposition composition due to evaporating the solvent; performing an oxidation-reduction reaction between the metal cation and the reducing anion in response to increasing the concentration of the reducing anion when the reducing anion is present at a critical concentration; and forming a metal from the metal cation to deposit the metal on the substrate. |
| 地址 |
GAITHERSBURG MD US |
