DICING FILM AND DICING DIE BONDING FILM

摘要

The present invention relates to a dicing film which comprises a base film and an adhesive layer, wherein the storage elastic modulus of the adhesive layer is 3×105 to 4×106 Pa at 30°C and the cross-linking density of the adhesive layer is 80% to 99%; to a dicing die bonding film comprising the dicing film; and to a method for dicing a semiconductor wafer using the dicing die bonding film.