| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package includes a substrate, a first passivation layer disposed on the substrate, and an under bump metallurgy layer disposed on the first passivation layer. A passive device is disposed on the under bump metallurgy layer, and an additional under bump metallurgy layer is disposed on the first passivation layer, isolated from the under bump metallurgy layer. A conductive pillar is disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level. |
| 申请公布号 |
US2015194403(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201514663755 |
申请日期 |
2015.03.20 |
| 申请人 |
MediaTek Inc |
发明人 |
CHAN Kuei-Ti;LIN Tzu-Hung;HUANG Ching-Liou |
| 分类号 |
H01L23/00;H01L23/528;H01L23/31;H01L23/64;H01L23/66 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a substrate; a first passivation layer disposed on the substrate; an under bump metallurgy layer disposed on the first passivation layer; a passive device disposed on the under bump metallurgy layer; an additional under bump metallurgy layer disposed on the first passivation layer, isolated from the under bump metallurgy layer; and a conductive pillar disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level. |
| 地址 |
Hsin-Chu TW |
