发明名称 DEVICE FOR THE INJECTION OF CMP SLURRY
摘要 A device for the injection of CMP slurry used in chemical mechanical polishing includes a main body and an outputting member. The main body has an applying end and is configured to be driven to swing over a to-be-polished surface. The outputting member has a channel a plurality of spraying holes communicated with the channel. The channel extends along a central axis. The spraying holes are arranged on the outputting member along a route, and each of the spraying holes faces the to-be-polished surface. The outputting member is pivotally connected to the applying end, so that slurry flows in the channel and is delivered to the to-be-polished surface through the spraying holes. The device for the injection of CMP slurry can evenly distribute the slurry and properly control the slurry in terms of using amount, direction and coverage, and is easy to clean and maintain.
申请公布号 US2015190899(A1) 申请公布日期 2015.07.09
申请号 US201514588686 申请日期 2015.01.02
申请人 Kojem International Co., Ltd 发明人 LIU Yuan-Chou
分类号 B24B57/02 主分类号 B24B57/02
代理机构 代理人
主权项 1. A device for the injection of CMP slurry, comprising: a main body, having an applying end and being configured to be driven to swing over a to-be-polished surface; and an outputting member, having a channel and a plurality of spraying holes communicated with the channel, the channel extending along a central axis, the spraying holes being arranged on the outputting member along a route, each said spraying hole facing the to-be-polished surface, and the outputting member being pivotally connected to the applying end, so that slurry flows in the channel and is delivered to the to-be-polished surface through each said spraying hole.
地址 Hsinchu City TW