CHIP GRINDING APPARATUS

摘要

Disclosed is a chip grinding apparatus capable of polishing a chip mounted on a substrate. The chip grinding apparatus comprises: a bit to polish the ship by being combined to a frame and moved to a position of the chip; a laser sensor which is connected to the frame and senses a distance to the edge of the chip and a distance to the position of the chip adjacent to the edge of the chip after irradiating one or more edge positions of the chip and the position of the substrate adjacent to the edge of the chip with laser and receiving the laser; and a control unit to set a gradient and thickness of the chip by using the distances sensed in the laser sensor and control the bit by using position coordinates and the gradient of the chip so the bit polishes the chip until the surface of the substrate is exposed.