ADHESIVE COMPOSITION, ADHESIVE SHEET USING THE SAME AND SEMICONDUCTOR PACKAGE

摘要

The present invention relates to an adhesive composition comprising a silicone resin with a 3D web structure having an aromatic ring compound as a substituent and an adhesive sheet and a semiconductor package using the same. A cured product formed from the composition represents excellent high gas barrier properties due to high crosslinking density of the silicone resin, and represents high light transmission due to high refractive index of the aromatic hydrocarbon radical and excellent adhesive properties and hardness.