| 发明名称 |
INTEGRATED CIRCUIT PACKAGE HAVING IMPROVED COPLANARITY |
| 摘要 |
One aspect of the present disclosure provides an IC substrate, comprising a first material layer located on a first side of the IC substrate, and a second material layer located on a second, opposing side of the IC substrate, wherein the second material layer has a higher coefficient of thermal expansion CTE value than the first material layer. |
| 申请公布号 |
US2015194360(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201414151671 |
申请日期 |
2014.01.09 |
| 申请人 |
Nvidia Corporation |
发明人 |
Zhang Leilei |
| 分类号 |
H01L23/14;H01L25/18;H01L23/538 |
主分类号 |
H01L23/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) substrate, comprising:
a first material layer located on a first side of said IC substrate; and a second material layer located on a second, opposing side of said PCB, said second material layer having a higher coefficient of thermal expansion (CTE) value than said first material layer. |
| 地址 |
Santa Clara CA US |
