| 发明名称 |
CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD |
| 摘要 |
The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range. |
| 申请公布号 |
US2015195899(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201314414846 |
申请日期 |
2013.07.18 |
| 申请人 |
Kaneka Corporation |
发明人 |
Kido Masayoshi;Sekito Yoshihide |
| 分类号 |
H05K1/02;H05K1/03 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive-layer-integrated flexible printed circuit board, comprising:
(A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within an infrared range. |
| 地址 |
Osaka JP |
