| 发明名称 |
SEMICONDUCTOR SECURED TO SUBSTRATE VIA HOLE IN SUBSTRATE |
| 摘要 |
A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole. |
| 申请公布号 |
US2015191349(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201214414333 |
申请日期 |
2012.07.11 |
| 申请人 |
Wu Jennifer;Zhang Zhuqing;Dingman Wallace Andrew |
发明人 |
Wu Jennifer;Zhang Zhuqing;Dingman Wallace Andrew |
| 分类号 |
B81C1/00;B81B7/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a semiconductor; and a substrate having a first surface and a second surface that opposes the first surface, wherein the substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole. |
| 地址 |
Corvallis OR US |
