发明名称 |
ELECTROSTATIC CHUCK WITH INTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION |
摘要 |
An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones. |
申请公布号 |
WO2015103047(A1) |
申请公布日期 |
2015.07.09 |
申请号 |
WO2014US72235 |
申请日期 |
2014.12.23 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
PARKHE, VIJAY D.;BUSCHE, MATTHEW J.;BOYD JR., WENDELL;THACH, SENH;MAKHRATCHEV, KONSTANTIN;ONO, MASANORI |
分类号 |
H01L21/683;B23Q3/15;H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|