METHOD FOR MANUFACTURING SOLDER BUMPS FOR FLIP CHIPS AND METAL ELECTROPLATING SOLUTION FOR THE SAME

摘要

The present specification discloses a tin based electroplating solution for manufacturing solder bumps for flip chip packages and a method for manufacturing solder bumps in a continuous plating process using the electroplating solution. According to the present invention, the tin based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonate, aromatic polyoxyalkylene ether, and water. According to the present invention, the method for manufacturing solder bumps includes: a step (1) of forming copper or copper/nickel pillar bumps on the top of a metal base layer by plating a silicone wafer having the metal base layer (UBM) and a protective layer with an opened electrode pad with a sulfuric acid-based copper or copper/nickel electroplating solution; and a step (2) of forming solder bumps using the tin based electroplating solution within twelve hours after the completion of the copper plating step.