| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hollow sealing resin sheet into which an electronic device may suitably be embedded, and a material composing the sealing resin sheet hardly flows into a gap between an adherend and the electronic device.SOLUTION: A test substrate, containing an inorganic filler having content of equal to or more than 56 vol.%, in a particle size distribution of which particles exceeding a width of a hollow part of a hollow package to be manufactured are more than 90 vol.%, flip-chip-connected to a plurality of chips, is used. After a hollow sealing resin sheet is disposed on the test substrate, when pressure is applied from the hollow sealing resin sheet side at 70°C, with pressure of 1 kgf/cm, at a vacuum degree of 10 Torr, a ration A/B of an entering speed A into gaps between chips of materials composing the hollow sealing resin sheet to an entering speed B into gaps between materials composing the hollow sealing resin sheet is equal to or more than 5.</p> |
