| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive and efficient cutting device and cutting method for manufacturing electronic components.SOLUTION: A cutting device 1 comprises: a length measurement reference member 17 which is fixed on a stage 2 and consists of a low thermal expansion material; reference marks M1, M2 which are provided on the length measurement reference member 17; a spindle 10; a rotary cutter 12 which is fixed on a rotation shaft 11 of the spindle 10; and a camera 13 which is fixed on the spindle 10. Coordinates of the reference mark M2 are known in a coordinate system with the reference mark M1 as an origin. Coordinates of an alignment mark A1 are calculated on the basis of positions of the camera 13 when the reference mark M1 is imaged and when the alignment mark A1 on a substrate 15 is imaged. Coordinates of an alignment mark A2 are calculated on the basis of positions of the camera 13 when the reference mark M2 is imaged and when the alignment mark A2 is imaged. On the basis of the coordinates of the alignment marks A1, A2, a cutting line to be cut and the rotary cutter 12 are aligned. |
