BALL GRID ARRAY SYSTEM

摘要

Systems and methods for providing a ball grid array connection include providing a circuit board having a circuit board surface including a plurality of pads. A ball grid array component includes a plurality of solder balls. The ball grid array component is coupled to the circuit board to position each of the plurality of solder balls adjacent a respective one of the plurality of pads. A solder reflow process is then performed to produce a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads. At least one spacer member is provided between the ball grid array component and the circuit board during the solder reflow process to provide a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections.

主权项

1. A ball grid array system, comprising:
a circuit board having a circuit board surface, the circuit board including:
a plurality of pads that are located on the circuit board surface; andat least one spacer member extending from the circuit board surface and located adjacent the plurality of pads; and a ball grid array component including:
a plurality of solder balls; wherein the at least one spacer member is configured such that, during a solder reflow process, the at least one spacer member provides a mechanical stop to the ball grid array component and a minimum height for a plurality of soldered connections that are each produced by a respective one of the plurality of solder balls and a respective one of the plurality of pads as a result of the solder reflow process.