METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING CAVITIES TO DISTRIBUTE CONDUCTIVE PATTERNING RESIDUE

摘要

Methods of manufacturing a semiconductor device include forming a conductive layer on a substrate, forming an air gap or other cavity between the conductive layer and the substrate, and patterning the conductive layer to expose the air gap. The methods may further include forming conductive pillars between the substrate and the conductive layer. The air gap may be positioned between the conductive pillars.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming a conductive layer on a substrate; forming an air gap between the conductive layer and the substrate; and patterning the conductive layer to expose the air gap.