| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can stably release heat of a semiconductor module by closely contacting the semiconductor module and a cooler.SOLUTION: A semiconductor device comprises: a hexagon nut 81 movably buried in a terminal block 70, 71 in a state of being baffled; and a bus bar 21, 22 which has flexibility and forms a gap 77 with a nut mounting surface 76 of the terminal block 70, 71 in a state of before being fastened. At the terminal block 70, 71, terminals 44, 45 of the semiconductor module 40, 41, 42 and the bus bar 21, 22 are attached by a hexagon bolt 80 and the hexagon nut 81. |
