发明名称 Optoelectronic Semiconductor Chip
摘要 An optoelectronic semiconductor chip includes an interconnection layer with a first electrically conductive contact layer, a second electrically conductive contact layer and an insulation layer, which is formed of an electrically insulating material. Further, the optoelectronic semiconductor chip includes two optoelectronic semiconductor bodies, each of which include an active region that is intended to generate radiation. The insulation layer is arranged on a top of the second electrically conductive contact layer facing the optoelectronic semiconductor bodies. The first electrically conductive contact layer is arranged on a top of the insulation layer remote from the second electrically conductive contact layer. The optoelectronic semiconductor bodies are interconnected electrically in parallel by the interconnection layer.
申请公布号 US2015194411(A1) 申请公布日期 2015.07.09
申请号 US201314407891 申请日期 2013.05.27
申请人 OSRAM Opto Semiconductors GmbH 发明人 von Malm Norwin
分类号 H01L25/075;H01L23/538;H01L33/62 主分类号 H01L25/075
代理机构 代理人
主权项
地址 Regensburg DE