WIRING SUBSTRATE, DROPLET EJECTION HEAD, PRINTING APPARATUS, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR WIRING SUBSTRATE

摘要

A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.

主权项

1. A wiring substrate comprising:
a first substrate having a first surface; a second substrate connected to the first substrate via an adhesive and having a second surface; and a first wire and a second wire set along surfaces of the first surface, the adhesive, and the second surface, wherein the wiring substrate includes, between the first wire and the second wire, a recessed section forming a recess with respect to a first bonding surface of the adhesive in contact with the first wire and a second bonding surface of the adhesive in contact with the second wire.