发明名称 LED SUPPORT, LED AND BACKLIGHT MODULE
摘要 The invention discloses a LED support comprising an opaque housing. A mounting face for placing at least one LED chip is provided inside the housing. At least two light-exiting windows are provided on the housing so as to allow light emitted from the LED chip to emit outwards from the housing therethrough. The LED support enables a LED assembled with the LED support to emit light from at least two sides, thus light-emitting angle of LED is enlarged, and thereby application range of LED is widened. Meanwhile, with such LED support, the number of the light-exiting windows of the LED comprising the LED support is increased, thus the times by which light from the LED chip mounted on the LED support is reflected inside the LED support is decreased, and thereby light emission efficiency is improved significantly.
申请公布号 US2015192278(A1) 申请公布日期 2015.07.09
申请号 US201414421524 申请日期 2014.04.25
申请人 BOE TECHNOLOGY GROUP CO., LTD. ;BEIJING BOE CHATANI ELECTRONICS CO., LTD. 发明人 Meng Yingli
分类号 F21V15/01;F21V8/00;F21V19/00;F21V7/00 主分类号 F21V15/01
代理机构 代理人
主权项
地址 Beijing CN