| 发明名称 |
Chip arrangement and method of manufacturing the same |
| 摘要 |
A chip arrangement is provided which comprises a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged between the at least two chips and between the carrier and at least one of the at least two chips. |
| 申请公布号 |
US2015194377(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201414147547 |
申请日期 |
2014.01.05 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
MAHLER Joachim;Strobel Peter;Fuergut Edward |
| 分类号 |
H01L23/495;H01L23/31;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip arrangement comprising:
a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged between the at least two chips and between the carrier and at least one of the at least two chips. |
| 地址 |
Villach AT |
