| 发明名称 |
PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE |
| 摘要 |
Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate. |
| 申请公布号 |
US2015194370(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201514663182 |
申请日期 |
2015.03.19 |
| 申请人 |
INTERSIL AMERICAS LLC |
发明人 |
Yin Jian;Kelkar Nikhil Vishwanath;Carpenter, JR. Loyde Milton |
| 分类号 |
H01L23/495;H01L23/31;H01L25/16 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit comprising:
a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate. |
| 地址 |
Milpitas CA US |
