| 发明名称 |
SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOMATION DEVICE TO A HEAT SINK |
| 摘要 |
A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows. |
| 申请公布号 |
US2015194367(A1) |
申请公布日期 |
2015.07.09 |
| 申请号 |
US201414147285 |
申请日期 |
2014.01.03 |
| 申请人 |
ROCKWELL AUTOMATIONJ TECHNOLOGIES, INC. |
发明人 |
Grosskreuz Paul Jerome;Zhou Rui;Bronk Kelly James;Kopiness Jeremiah John |
| 分类号 |
H01L23/40;H01L21/52;H01L21/66 |
主分类号 |
H01L23/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system, comprising:
a heat sink; a semiconductor device; a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, wherein the TIM is configured to facilitate dissipation of heat generated by the semiconductor device via the heat sink; a fastener system configured to couple the semiconductor device to the heat sink about the layer of TIM; and one or more washers of the fastener system that are configured to maintain a coupling force between the semiconductor device and the heat sink after the TIM flows. |
| 地址 |
Mayfield Heights OH US |
