发明名称 CURED THERMOSET FOR HIGH THERMAL CONDUCTIVE MATERIALS
摘要 An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150 °C or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
申请公布号 WO2015100555(A1) 申请公布日期 2015.07.09
申请号 WO2013CN90956 申请日期 2013.12.30
申请人 DOW GLOBAL TECHNOLOGIES LLC;ROHM AND HASS COMPANY;LIU, WEI;SONG, XIAOMEI;CHEN, HONGYU;HUANG, YAN;ZHANG, YU 发明人 LIU, WEI;SONG, XIAOMEI;CHEN, HONGYU;HUANG, YAN;ZHANG, YU
分类号 C08L63/00;C08K3/00;H01L31/00;H01L33/00 主分类号 C08L63/00
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