CURED THERMOSET FOR HIGH THERMAL CONDUCTIVE MATERIALS
摘要
An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150 °C or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
申请公布号
WO2015100555(A1)
申请公布日期
2015.07.09
申请号
WO2013CN90956
申请日期
2013.12.30
申请人
DOW GLOBAL TECHNOLOGIES LLC;ROHM AND HASS COMPANY;LIU, WEI;SONG, XIAOMEI;CHEN, HONGYU;HUANG, YAN;ZHANG, YU