THERMAL ADHESIVE

摘要

The present invention relates to a thermal conductive adhesive. The present invention comprises a polysiloxane resin matrix and a metal nanorod filler. According to the present invention, it is possible to provide a thermal conductive adhesive composition wherein a thermal conductivity is excellent even with a charge capacity of a small amount of filler; and production process properties, stability of a cured product after the processing such as coating, spreading, etc., and mechanical properties thereof such as hardness, adhesive strength, tensile strength, etc. are excellent.