发明名称 接続方法、接続体の製造方法、接続体
摘要 <p>In order to decrease mounting temperature and ensure connection reliability, a connected-body production method is provided with a step for bonding a connecting body and a body to be connected to one another using a photo-curable adhesive, hardening the adhesive by irradiating the same with light, and connecting the connecting body and the body to be connected. Therein, the level of illumination by light is increased continuously or stepwise.</p>
申请公布号 JP5745944(B2) 申请公布日期 2015.07.08
申请号 JP20110126642 申请日期 2011.06.06
申请人 发明人
分类号 H05K3/32;H05K3/36 主分类号 H05K3/32
代理机构 代理人
主权项
地址