发明名称 Method and apparatus to configure thermal design power in a microprocessor
摘要 A method for configuring thermal design power (TDP) in a processor comprises changing via one or more model specific register (MSR) a value of a configurable TDP in response to user control; and causing an operating system as part of the configurable TDP change to evaluate an Advanced Configuration and Power Interface (ACPI) Performance Present Capabilities (PPC) object under each of a plurality of logical processors. Preferably, the configurable TDP value is to change, including a change in a turbo ratio value, in response to a platform facilitated user control trigger; where the user control may be intercepted and converted to a basic input/output software (BIOS) call to cause the TDP change. The configurable TDP value may cause a corresponding change in a turbo mode target frequency. The method may comprise changing the configurable TDP value in response to a platform facilitated user control trigger with a power supply change from alternating current (AC) to direct current (DC) or vice versa; or a docking event.
申请公布号 GB2521949(A) 申请公布日期 2015.07.08
申请号 GB20150003502 申请日期 2011.12.08
申请人 INTEL CORPORATION 发明人 GUY M THERIEN;RYAN D WELLS;STEPHEN H GUNTHER;JEREMY J SHRALL;ERIC DISTEFANO;VASUDEVAN SRINIVASAN;VENKATESH RAMANI;JAMES G HERMERDING II;TAWFIK RAHAL-ARABI
分类号 G06F1/20;G06F1/32 主分类号 G06F1/20
代理机构 代理人
主权项
地址