发明名称 |
Apparatus and method for providing a seal around a perimeter of a bi-material enclosure |
摘要 |
<p>An enclosure includes a seal 108 co-molded to a first material 102 to form a subÂassembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material 104 over-molded on the subÂassembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities. A groove may be etched with a micro pattern onto a prefabrication of the first material to enhance adhesion of the seam to the first material. The invention is particularly useful for fabricating a housing for a mobile device wherein a thin metal sheet may be over-moulded by a thicker plastic enclosure. The seal prevents any leakage paths and the deflection of the seal allows for relaxation of the seal during temperature shock cycles.</p> |
申请公布号 |
GB2521918(A) |
申请公布日期 |
2015.07.08 |
申请号 |
GB20140019764 |
申请日期 |
2014.11.06 |
申请人 |
MOTOROLA SOLUTIONS, INC. |
发明人 |
KIOK YUNG LEE;KIT CHEE CHAN;BOON AIK EEO;WENG KONG HOR;BAN HIN OOL;TOBIAS XAVIER PAKIAM |
分类号 |
B29C45/14;H04M1/02;H05K5/00 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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