SEMICONDUCTOR PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor package module and a method for manufacturing the same. A semiconductor package module according to the embodiment of the present invention may include: a substrate where an insulating layer and circuit patterns are formed; a first bonding part which is partly formed on the upper part of the circuit patterns; a second bonding part which is partly formed in the upper part of the circuit patterns; a first semiconductor device mounted on the substrate; a first connection member which electrically connects the first bonding part and the first semiconductor device; a second connection member which has one surface bonded to the second bonding part and an end exposed to the outside; and an oxide layer which is formed on all regions except the first bonding part and the second bonding part.