发明名称 LED PACKAGE, METHOD OF FABRICATING THE SAME, AND BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE LED PACKAGE
摘要 <p>The present invention provides an LED package which includes an LED chip, a base on which the LED chip is mounted, and a case which includes a first side and a second side which are upwardly bent from the base and face each other and a third side and a fourth side which face the first side and the second side and connect the first side and the second side. The height of at least one of the third side and the fourth side is higher than the heights of the first side and the second side.</p>
申请公布号 KR20150077584(A) 申请公布日期 2015.07.08
申请号 KR20130166078 申请日期 2013.12.27
申请人 LG DISPLAY CO., LTD. 发明人 LEE, SUK WOO;KIM, GYU SAM
分类号 H01L33/54;H01L33/48 主分类号 H01L33/54
代理机构 代理人
主权项
地址
您可能感兴趣的专利