<p>The present invention relates to a non-spherical polishing particle and a slurry composition including the same and, more specifically, a slurry composition for polishing copper films and a flexible film including spherical polishing particles and non-spherical polishing particles wherein the non-spherical particle is 10 % of the total polishing particles.</p>
申请公布号
KR20150077542(A)
申请公布日期
2015.07.08
申请号
KR20130165530
申请日期
2013.12.27
申请人
K.C.TECH CO., LTD.
发明人
YOON, YOUNG HO;YOON, JOO HYOUNG;PARK, HAN TEO;LEE, HYE HEE;KIM, HYUN JI;HWANG, JIN SOOK;LEE, JAE WOO;PARK, GWANG SU
