| 摘要 |
<p>The present invention provides a substrate treating apparatus. The substrate treating apparatus includes a dry chamber which dries a substrate by solving an organic solvent on the substrate by a fluid which is supplies as a supercritical fluid, a supply unit which supplies the fluid to the dry chamber, a reproducing unit which includes a buffer tank which stores the fluid discharged from the dry chamber, reproduces the fluid by separating the organic solvent from the fluid, and supplies the reproduced fluid to the supply unit, and a circulation line which successively connects the dry chamber, the supply unit, and the reproducing unit. The supply unit includes a condenser, a feeding tank which receives and stores the fluid which is liquefied in the condenser, a pump which is installed on the circulation line between the condenser and the feeding tank and supplies the fluid to the feeding tank, and a connection line which supplies the fluid supplied through the pump to the buffer tank. The connection line is branched from the circulation line between the pump and the dry chamber and is connected to the buffer tank.</p> |
