| 摘要 |
<p>Provided is an electronic component transfer device capable of re-arranging electronic components remaining on a wafer sheet on the pickup side so as to allow re-use. This electronic component transfer device (1) is provided with: an electronic component holding table (11) which holds a wafer sheet (200) on which multiple electronic components (100) of different ranks are arranged in a wafer shape; an electronic component information storage unit (41) which stores electronic component information comprising position information about the electronic components (100) on the wafer sheet (200) on the electronic component holding table (11) and rank information about said electronic components (100); a transfer head (30) which extracts one or more electronic components (100) from the wafer sheet (200) at a time and transfers the same to an arrangement unit (300); an arrangement information storage unit (42) which stores arrangement information about the electronic components (100) in the arrangement unit (300); a re-arrangement unit (400) which re-arranges the remaining electronic components remaining on the wafer sheet (200); and a control unit which controls the transfer head (30) so as to transfer the electronic components (100) to prescribed positions in the arrangement unit (300) on the basis of the electronic component information and arrangement information, and transfers remaining electronic components remaining on the wafer sheet (200) to the re-arrangement unit (400).</p> |
